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Original scientific paper

An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour

By
Rohit Upadhyay ,
Rohit Upadhyay

Research & Development, General Mills India Pvt Ltd., Mumbai 79, India India

Rohit Thirumdas ,
Rohit Thirumdas

Department of Food Engineering & Technology, Institute of Chemical Technology , Mumbai , India

Rajendra R. Deshmukh ,
Rajendra R. Deshmukh

Institute of Chemical Technology , Mumbai , India

Uday Annapure ,
Uday Annapure

Department of Food Engineering & Technology, Institute of Chemical Technology , Mumbai , India

Nrusimha N. Misra
Nrusimha N. Misra
Contact Nrusimha N. Misra

Department of Engineering, Faculty of Agriculture, Dalhousie University , Halifax , Canada

Abstract

This work explores the preliminary feasibility of employing low-pressure cold plasma technology for the modification of the properties of chia flour. Chia flour was exposed to low-pressure plasma in the air for 5 min, 10 min, and 15 min, at two different power levels (40 W and 60 W). The oils extracted from untreated and treated chia flour were exhaustively characterized for fatty acid composition, nutritional value, and rancidity indices using thermal calorimetric methods (DSC/TGA). The results indicated a significant change in the color of flour with an increase in lightness. Infrared and ultraviolet spectroscopy indicated changes in the tocopherol groups of the oil extracted from plasma-treated chia flour. However, the oil extracted from plasma-treated chia flour revealed a loss of conjugated dienes and the formation of trans-fatty acids as seen in conventional hydrogenation of edible oils. DSC and TGA results revealed better oxidative stability of low-pressure plasma-treated oils than in control, which was linked to a relative increase of MUFA in the former.

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Authors retain copyright. This work is made freely available online under an open-access model under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License (CC-http://creativecommons.org/licenses/by-nc-nd/4.0/BY-NC-ND 4.0).

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