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Original scientific paper

An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour

By
Rohit Upadhyay ,
Rohit Upadhyay

Research & Development, General Mills India Pvt Ltd., Mumbai 79, India, India

Rohit Thirumdas ,
Rohit Thirumdas

Department of Food Engineering & Technology, Institute of Chemical Technology, Mumbai, India

Rajendra R. Deshmukh ,
Rajendra R. Deshmukh

Institute of Chemical Technology, Mumbai, India

Uday Annapure ,
Uday Annapure

Department of Food Engineering & Technology, Institute of Chemical Technology, Mumbai, India

Nrusimha N. Misra
Nrusimha N. Misra
Contact Nrusimha N. Misra

Department of Engineering, Faculty of Agriculture, Dalhousie University, Halifax, Canada

Abstract

This work explores the preliminary feasibility of employing low-pressure cold plasma technology for the modification of the properties of chia flour. Chia flour was exposed to low-pressure plasma in the air for 5 min, 10 min, and 15 min, at two different power levels (40 W and 60 W). The oils extracted from untreated and treated chia flour were exhaustively characterized for fatty acid composition, nutritional value, and rancidity indices using thermal calorimetric methods (DSC/TGA). The results indicated a significant change in the color of flour with an increase in lightness. Infrared and ultraviolet spectroscopy indicated changes in the tocopherol groups of the oil extracted from plasma-treated chia flour. However, the oil extracted from plasma-treated chia flour revealed a loss of conjugated dienes and the formation of trans-fatty acids as seen in conventional hydrogenation of edible oils. DSC and TGA results revealed better oxidative stability of low-pressure plasma-treated oils than in control, which was linked to a relative increase of MUFA in the former.

Citation

Authors retain copyright. This work is made freely available online under an open-access model under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License (CC-http://creativecommons.org/licenses/by-nc-nd/4.0/BY-NC-ND 4.0).

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