The samples of rolled copper were mechanically and electrochemically polished in suitable electrolytes for electrochemical polishing. These substrate surfaces that had been prepared in advance, served as the basis for depositing of copper layers from two baths, namely, from the basic electrolyte(OR) with the following composition: 240 g/dm3 Cu...

By M. V. Tomić, M. G. Pavlović, Lj. J. Pavlović, N. D. Nikolić

The effect different deposition regimes (constant and reversing currents), on the powdered copper electrodeposits morphology were investigated. The morphology of electrodeposited copper powder was investigated using a scanning electron microscope (SEM). The effect of the current amplitude, cathodic to anodic time ratio and period of the current wav...

By M. G. Pavlović, M. V. Tomić, Lj. Pavlović, V. Maksimović, N. D. Nikolić