UPADHYAY, Rohit et al. An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour. Journal of Engineering & Processing Management, [S.l.], v. 11, n. 2, p. 73-80, mar. 2020. ISSN 2566-3615. Available at: <https://jepm.tfzv.ues.rs.ba/index.php/Journal/article/view/220>. Date accessed: 07 july 2020. doi: https://doi.org/10.7251/JEPM1902073U.