Original scientific paper
Authors
This paper investigates the electrodeposition of a nickel coating on a copper substrate with dimensions (5 × 5 × 0.1) mm, focusing on the influence of parameters such as current density, electrolyte temperature and deposition time. Copper samples were treated in nickel-based electrolytes under different deposition times and current densities, while the temperature was maintained constant. In the electrochemical deposition process, copper plates were used as cathodes, while high-purity electrolytic nickel (99.999%) was used as the anode. Electrochemical nickel coatings were applied for 10, 15 and 20 minutes at current densities of 1.0, 1.5 and 2 A/dm2, at a bath temperature of 42 °C. The results show that deposition parameters significantly affect the morphology and physical-mechanical properties of the formed layers. With an increase in the current density, there is an increase in the thickness of the metal coating deposited on the copper surface, as well as with an increase in the time of the electrochemical process. Based on the obtained data, the work provides useful guidelines for the optimization of the process of electrochemical deposition of nickel on copper for industrial applications.
Keywords: copper, nickel coating, electrochemical deposition, roughness, current efficiency, coating thickness
How to Cite: Spasojević, S. , Milovanović, M. , Jovičić, D. , Stanišić, S. , Ristić, Z. , Mitrović, M. , Vasiljević, N. & Tomić, M. (2025) “Electrochemical nickel coatings deposition on copper”, Journal of Engineering & Processing Management. 17(2).