Original scientific paper

An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour

Authors

• • Rohit Upadhyay
  • Research & Development, General Mills India Pvt Ltd., Mumbai 79, India
• • Rohit Thirumdas
  • Institute of Chemical Technology, Department of Food Engineering & Technology, Mumbai, India
• • Rajendra R. Deshmukh
  • Institute of Chemical Technology, Mumbai, India
• • Uday Annapure
  • Institute of Chemical Technology, Department of Food Engineering & Technology, Mumbai, India
• • Nrusimha N. Misra
  • Dalhousie University, Faculty of Agriculture, Department of Engineering, Halifax, Canada

Abstract

This work explores the preliminary feasibility of employing low-pressure cold plasma technology for the modification of the properties of chia flour. Chia flour was exposed to low-pressure plasma in the air for 5 min, 10 min, and 15 min, at two different power levels (40 W and 60 W). The oils extracted from untreated and treated chia flour were exhaustively characterized for fatty acid composition, nutritional value, and rancidity indices using thermal calorimetric methods (DSC/TGA). The results indicated a significant change in the color of flour with an increase in lightness. Infrared and ultraviolet spectroscopy indicated changes in the tocopherol groups of the oil extracted from plasma-treated chia flour. However, the oil extracted from plasma-treated chia flour revealed a loss of conjugated dienes and the formation of trans-fatty acids as seen in conventional hydrogenation of edible oils. DSC and TGA results revealed better oxidative stability of low-pressure plasma-treated oils than in control, which was linked to a relative increase of MUFA in the former.

Keywords: electrical discharge, grains, fatty acid, functional property

How to Cite: Upadhyay, R. , Thirumdas, R. , Deshmukh, R. R. , Annapure, U. & Misra, N. N. (2019) “An exploration of the effects of low-pressure plasma discharge on the physico-chemical properties of chia (Salvia hispanica L.) flour”, Journal of Engineering & Processing Management. 11(2). doi: https://doi.org/10.7251/jepm1902073u